As we move closer to a working prototype of our wearable triage monitoring system, we’ve reached one of the most hands-on and critical phases of development: circuit assembly. While simulations and digital design helped us plan the architecture, it’s in this stage — the physical construction — where theory meets reality.
From Breadboard to Soldered Circuit
In the early stages of testing, we used breadboards to prototype and validate the electrical connections between components like the microcontroller, sensors (e.g., MLX90614, MAX30102), and power supply. This setup was excellent for experimenting and making quick changes.
However, to progress toward a wearable and robust prototype, we needed to permanently assemble the circuit by soldering the components onto a custom board. This step required precision, patience, and planning.
"Soldering" — the process of joining electronic components by melting a metal alloy (solder), allows for secure and compact connections, necessary for reliable long-term operation.
The Challenge: Maximizing Compactness
One of the most significant challenges during the assembly was minimizing the overall size of the circuit. Since our device is intended to be worn on a patient’s wrist or forearm, every millimeter counts. A bulky device would reduce comfort, hinder usability, and likely interfere with emergency procedures.
Strategies We Used:
- Stacking Components where possible, using header pins and vertical arrangements.
- Shortening Wires and Connectors to reduce clutter and improve signal reliability.
- Strategic Layout on the board to group related modules (e.g., sensors close to the micro-controller, power management isolated from signal lines).
Lessons Learned
Planning is everything
Having a clean schematic before soldering saved us a lot of time during assembly.
Compactness introduces complexity
While a smaller footprint is ideal, it also means tighter spaces for the soldering iron and higher risk of shorts — especially when multiple I2C devices share lines.
Modularity helps
Keeping some parts modular allows flexibility during testing and upgrades.
Next Steps
- Testing signal quality and sensor readings under harder conditions.
- Checking for overheating and power stability.
- Refining the design for the next version — to fix some of the problems that we faced during the tests.